ASE Technology Holding Co., Ltd. ASX | NYSE
Next Earnings: Jul 26, 2026
Company Overview:
10 Year ASX Performance Metrics:
ASX Dividend Payments, Yield & Share Price charts
Unlock All Reports & Research Dividend Stocks.
[lev_ptables no_sale]ASX Dividend Safety: Payout & Dividend to Free Cash Flow Ratios.
ASX Earnings, Revenue, Cash & Debt, Shares Outstaning:
Revenue, EPS, Net Income & Ebitda - Estimates VS Actual:
Ratios, Profit Margins & Return on Capital:
ASX Dividends Info:
ASX Dividend History: Dates, Payments & Yield list
Below is a schedule of all ASX dividend payments, ex-dates, share price on the day of the payment as well as TTM & forward yield
| Ex-Date | Payment Date | Amount | TTM Yield | Forward Yield | Price on Ex-Date |
|---|---|---|---|---|---|
| 07/06/2026 | 08/07/2026 | $0.417 | 0.96% | 0% | $0.00 |
| 07/02/2025 | 08/06/2025 | $0.356 | 3.46% | 3.66% | $9.72 |
| 07/02/2024 | 08/05/2024 | $0.316 | 2.87% | 3.68% | $8.60 |
| 06/30/2023 | 08/03/2023 | $0.563 | 7.22% | 7.39% | $7.62 |
| 06/29/2022 | 08/04/2022 | $0.016 | 0.3% | 0.27% | $6.02 |
| 09/03/2021 | 10/07/2021 | $0.011 | 0.12% | 0.15% | $7.14 |
| 08/13/2020 | 09/17/2020 | $0.005 | 0.1% | 0.11% | $4.25 |
| 08/10/2018 | 09/12/2018 | $0.005 | 0.11% | 0.12% | $4.55 |
| 08/09/2017 | 09/15/2017 | $0.008 | 0.12% | 0.13% | $5.99 |
| 08/15/2016 | 09/16/2016 | $0.008 | 0.13% | 0.14% | $5.76 |
| 08/10/2015 | 09/18/2015 | $0.010 | 0.19% | 0.18% | $5.50 |
| 08/13/2014 | 09/26/2014 | $0.007 | 0.12% | 0.12% | $6.04 |
| 07/30/2013 | 09/13/2013 | $0.006 | 0.15% | 0.13% | $4.52 |
| 08/13/2008 | 09/19/2008 | $0.009 | 0.23% | 0.3% | $2.94 |
Projected Future Returns & Dividends for ASX
Based on past 10-year performance, here are ASX growth metrics:
Share price CAGR of +20.58%
Dividend CAGR of +49.22%
Using ASX CAGR metrics, we can estimate that your initial $10000 investment, over the next 10 years, should grow as follows:
| ASX (DRIP) | ASX - No DRIP | |
|---|---|---|
| Current Price | $36.84 | $36.84 |
| Start Shares | 271.44 | 271.44 |
| Start Value | $10,000 | $10,000 |
| After 10 years: | ||
| Final Share Count | 1,082.10 | 271.44 |
| Dividends Payment | $22.83 | $22.83 |
| Annual Dividends | $98,802 | $24,785 |
| Yield on cost | 988.02% | 247.85% |
| Share Price | $239.36 | $239.36 |
| Total Dividends | $119,855 | $49,437 |
| Final Value | $259,014 | $114,410 |
NOTE: Above numbers are our estimate based on ASX's Dividend and Price CAGR over past 10 years.
These numbers should only be considered as "potential future returns"! DRIP assumes reinvesting dividends; No-DRIP assumes collecting dividends as cash.
We cannot guarantee that your actual returns will meet these estimates.
Get the best Dividend Stock Research Tools:
[lev_ptables no_sale]Company Info
ASE Technology Holding Co., Ltd. (ASX) had its IPO on 2000-10-02, and is trader on NYSE stock exchange.
Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.
ASX website: https://www.aseglobal.com
